Scholarships

Certified Meeting Professional Scholarships

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The Events Industry Council (EIC) offers the Certified Meeting Professional (CMP) program.

The CMP program aims to increase the professionalism of meeting management professionals in all sectors of the industry by:

  • Identifying a comprehensive body of knowledge in the meeting management profession

  • Promoting industry standards, practices, and ethics

  • Stimulating the advancement of the art and science of meeting management

  • Increasing the value of Certified Meeting Professionals to their employers

    This scholarship is for first-time testing only—you cannot apply for retesting or re-certification. You must be at least 21 years old. 

Apply Online- Click here to apply for certification registration through EIC. There is a $350 application fee that we do not pay.

Apply Online- Click here to apply for TSYLF funding for the CMP scholarship.

TSYLF CMP Scholarship Application
Your completed application must include:

Once approved to take the exam, the Timothy S.Y. Lam Foundation will pay the $525 testing fee directly to EIC on your behalf.

  • Essay response within the application form

  • Copy of your exam approval notice from EIC or invoice for exam fees

  • Current resume

  • Digital photo/headshot in jpeg or png format with a neutral or professional background and avoid “selfies.”

  • Signature of applicant & witness on the application form

  • Letter of recommendation (to be sent separately, see details below)

A letter of recommendation/support must be submitted from a current or former manager, instructor, or peer who can attest to your commitment to the hospitality industry. The letter must be on official letterhead include complete contact information of the referrer and be sent separately by clicking on the tab below:

Please review the FAQs about the CMP certification and application process.


Application Schedule

Winter Full applications are due by: February 15

Spring Full applications are due by: May 15

Summer Full applications are due by: August 15

Fall Full applications are due by: November 15